Redmi Turbo Four is about to reach in China in early 2025. The corporate has confirmed that it will likely be the primary cellphone to launch with the MediaTek Dimensity 8400-Extremely chipset. Notably, MediaTek lately launched its Dimensity 8400 SoC. Realme has confirmed that considered one of its future handsets will carry this processor. A tipster claims that it will likely be the Realme Neo 7 SE. It’s anticipated to affix the Realme Neo 7, launched in China earlier this month.
Redmi Turbo Four Launch
Redmi confirmed in a Weibo submit that its upcoming Turbo Four handset, which is about to launch in early 2025, will likely be powered by a MediaTek Dimensity 8400-Extremely SoC. It’s claimed to be the primary cellphone to get that chipset.
Earlier leaks have claimed that the Redmi Turbo Four will seemingly arrive in China by January 2025. A leaked design render of the upcoming smartphone suggests it’ll have a twin rear digital camera setup and a flat show with uniform, very slim bezels.
Realme Neo 7 SE Teased
Realme, alternatively, teased the launch of a brand new smartphone with the MediaTek Dimensity 8400 SoC, which was lately unveiled. The corporate didn’t reveal the identify of the upcoming handset. Tipster Digital Chat Station (translated from Chinese language) steered that this could possibly be the Realme Neo 7 SE.
The MediaTek Dimensity 8400 chipset sits above the Dimensity 8300 and comes with eight Arm Cortex-A725 cores, the place a major core clocks at 4.32GHz. It’s paired with the Arm Mali-G720 GPU and is claimed to assist as much as LPDDR5x RAM and UFS 4.zero onboard storage. The processor features a MediaTek NPU 880, which helps it carry out generative AI duties.
The most recent MediaTek chipset additionally has an inbuilt MediaTek Imagiq 1080 ISP which is claimed to assist seize extra mild and focus quicker. Smartphones with this SoC are mentioned to assist as much as 320-megapixel digital camera sensors and shows with as much as WQHD decision with as much as 144Hz refresh charge.
