Apple’s New Model of 5G Modem May Debut in iPhone 18 Professional Fashions

Apple’s New Model of 5G Modem May Debut in iPhone 18 Professional Fashions

iPhone 17 collection continues to be months away from launch however that has not stopped the hearsay mill from churning out particulars about subsequent yr’s iPhone 18 collection. Most lately, a outstanding analyst opined that iPhone 18 Professional fashions will include Apple’s second-generation modem. The iPhone maker launched its first-ever in-house modem, C1, with the iPhone 16e. The primary mobile modem designed by Apple is claimed to ship quick and dependable 5G mobile connectivity.

Apple’s Subsequent In-Home Modem May Debut Subsequent Yr

As reported by 9to5mac, Jeff Pu of GF Securities outlined his expectations for the iPhone 18 collection in his newest be aware to traders. The analyst reportedly expects Apple to pack the “C2” modem within the iPhone 18 Professional and iPhone 18 Professional Max in 2026.

This is not the primary time the event of the second-generation Apple modem has been talked about, Bloomberg’s Mark Gurman additionally claimed in February that Apple is planning to make use of the C2 modem subsequent yr in “higher-end iPhones”. 

Additional, Pu reportedly mentioned that Apple needs to pack the C1 within the upcoming iPhone 17 Air, however the firm might name off this determination. It’s unsure if Apple might use the C1 chip in iPhone 18 fashions whereas reserving the purported C2 for Professional fashions. The corporate might retain the Qualcomm 5G modem for the premium fashions.

The C1 which debuted with the iPhone 16e final month lacks assist for mmWave, which is the extraordinarily excessive frequency (EHF) band. This can lead to slower obtain and add speeds on the cellphone. A refreshed model of Apple’s C1 modem is claimed to be in improvement with mmWave assist. Releasing new in-house chips will make Apple much less depending on exterior suppliers together with Qualcomm.

Leave a Reply

Your email address will not be published. Required fields are marked *