New Delhi: Prime Minister Narendra Modi on Wenesday laid basis stone for 3 monumental semiconductor ventures, collectively valued at Rs 1.25 lakh crore. PM Modi digitally graced the occasion ‘India’s Techade: Chips for Viksit Bharat’ on Wednesday to flagg off these initiatives.
Realizing the Prime Minister’s dream of remodeling India right into a powerhouse of semiconductor design, manufacturing, and innovation, the groundwork shall be laid for the Semiconductor fabrication unit at Dholera Particular Funding Area (DSIR) in Gujarat, together with two Outsourced Semiconductor Meeting and Check (OSAT) services—one in Morigaon, Assam, and the opposite in Sanand, Gujarat.
These state-of-the-art services are poised to fortify India’s semiconductor panorama and safe a strong place for the nation on this high-tech area. They promise to unlock 1000’s of job alternatives for the Indian youth, not solely throughout the semiconductor sector but additionally in ancillary industries corresponding to electronics and telecommunications.
The occasion is anticipated to attract a powerful crowd, together with an enormous variety of faculty college students and eminent figures from the semiconductor sphere.
Tata Electronics Personal Restricted (TEPL) is tasked with establishing the DSIR’s Semiconductor fabrication facility below the Modified Scheme for organising of Semiconductor Fabs in India. This mission, with an funding exceeding Rs 91,000 crore, marks the debut of the nation’s first business semiconductor fabrication plant.
The Morigaon OSAT facility, additionally below the aegis of TEPL, will come to life by means of the Modified Scheme for Semiconductor Meeting, Testing, Marking, and Packaging (ATMP), with an funding nearing Rs 27,000 crore.
Equally, CG Energy and Industrial Options Restricted will spearhead the creation of the Sanand OSAT facility below the identical scheme, with an funding of roughly Rs 7,500 crore.
